Wafer Slicing Services

First Philec Solar Corporation (FPSC) and First Philec Nexolon Corporation (FPNC) provides wafer slicing services for the solar energy industry.

FPSC and FPNC have the latest wire saw technology available, capable of producing up to 155 micron-thin silicon wafers, and fully-automated cleaning systems and automated inspection systems. The companies pride themselves in having quick cycle time with customized packaging, labeling and shipping, and a strong R&D optimizing process, equipment and materials.

Product specifications:

Wafer types: